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| FREQUENCY QESM04 SMD 6.0x3.5 Crystal - Ceramic SMD packaged Specification (Rev-D) Electrical Characteristics ......................................................P01 ESR vs. frequency range and Mode of vibration ..................P01 Mechanical Characteristics ...................................................P01 Ordering Information .............................................................P02 Suggested Reflow Soldering profile ......................................P02 Tape Drawing........................................................................P03 Reel Drawing ........................................................................P03 Frequency QESM04 SMD 6.0x3.5 Crystal - Ceramic SMD packaged Specification (rev-D) September 01th, 2006 Electrical Characteristics Electrical Parameters Frequency range Temperature Stability Operating Temperature Range Storage temperature range Shunt capacitance C0 Load capacitance Drive level Aging (First Year) Insulator resistance Unit MHz ppm C C pF pF W ppm M 500 10 -40 Minimum Typical Maximum 10 10 10 30 30 -20/+70 80 50 50 -40/+85 +85 7.0 10pF ~ 30pF or series 100 3 Ref at 25C At 100VDC Customized specification upon request Refer to Ordering Information Refer to Ordering Information Refer to Ordering Information Refer to Ordering Information Test conditions Frequency Tolerance (at 25C) ppm ESR vs. frequency range and Mode of vibration Frequency range (MHz) 10.000 to 10.999 11.000 to 11.999 12.000 to 15.999 Mode of vibration Max ESR () Fund. / AT Fund. / AT Fund. / AT 100 80 60 Frequency range (MHz) 16.000 to 39.999 40.000 to 80.000 Mode of vibration Fund. / AT 3rd/ AT Max ESR () 40 70 Mechanical Characteristics Marking for QESM04 Manuf code +Temex code (6 digits) Line 2 Frequency in MHz (6digits) Line 1 Mechanical conditions Vibration 10g, 10Hz to 2KHz according to standard CEI 68-2-63 Shocks 100g, 6ms according to standard CEI 68-227 Top view Suggested pad Note 1 : QESM04 is fully RoHS compliant. H H = 1.1 mm max 1 TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost. Frequency QESM04 SMD 6.0x3.5 Crystal - Ceramic SMD packaged Specification (rev-D) September 01th, 2006 Ordering Information QESM04 1 10 Part numbering system JQ 10 08 39.000MHZ Package type Vibration mode 1=Fundamental 3=3rd overtone Frequency tolerance Operating temperature range Frequency stability Load Capacitance 00=series 10=10pF 30=30pF Please, enter the value of load capacitance Nominal Frequency (MHz) Please enter the nominal frequency SMD Package QESM04 : SMD ceramic 6.0 x 3.5 4 pads 10=10ppm 20=20ppm 30=30ppm 50=50ppm D=-40C F= -30C H=-20C J=-10C L=0C M=+50C N=+55C O=+60C Q=+70C T=+85C 10=10ppm 20=20ppm 30=30ppm 50=50ppm Suggested Reflow Soldering Profile 2 TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost. Frequency QESM04 SMD 6.0x3.5 Crystal - Ceramic SMD packaged Specification (rev-D) September 01th, 2006 Tape Drawing Item Pitch of components Pitch of sprocket hole Length from hole center to component center Width of carrier tape Width of adhesive tape Height of component hole Width of component hole Gap of hold down tape and carrier tape Diameter of sprocket hole Diameter of feed hole Total of tape thickness Code P Po P1 W W0 A B W2 Do D1 K Dimension 8.0 4.0 2.0 16.0 7.5 7.1 4.7 1.75 1.5 1.5 1.5 Tolerance 0.1 0.1 0.1 0.3 0.1 0.1 0.1 0.1 0.05 0.25 0.1 Reel Drawing 2.5 13.5 O21.6 O13.5 Multiple : 1Kpcs per Reel Unit : mm O178 1.6 3 TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost. |
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